Preparation and Properties of Polyimide/Mesoporous SiO<sub>2</sub> Composite Films with Low Dielectric Constant

Zi-xiang Wang; Rong-rong Zheng; Lei Han; Shu-wu Chen; Hong-tao Wu; Jing-ying Wang; Xing-wei Li; Hongjing Liu; Liyan Wang

doi:doi:10.11648/j.ajpst.20220802.11

Preparation and Properties of Polyimide/Mesoporous SiO₂ Composite Films with Low Dielectric Constant

Zi-xiang Wang, Rong-rong Zheng, Lei Han, Shu-wu Chen, Hong-tao Wu, Jing-ying Wang, Xing-wei Li, Hongjing Liu, Liyan Wang

Published in American Journal of Polymer Science and Technology (Volume 8, Issue 2)

Received: 11 April 2022 Accepted: 4 May 2022 Published: 24 May 2022

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Abstract

In this paper, mesoporous silica (NH₂-SiO₂) containing amino groups was firstly prepared using amino-ended hyperbranched polyamides as template agent and KH550 as surface treatment agent, and then polyimide/mesoporous NH₂-SiO₂ composites with low dielectric constant were successfully prepared by in situ polymerization method. The composite materiasl not only have excellent thermal properties but also have a very low dielectric constant compared to pure polyimides. The SEM results show that the surface of mesoporous NH₂-SiO₂ has an increased amount of wrinkles after surface treatment, and a uniform film is formed due to the excellent compatibility of mesoporous NH₂-SiO₂ containing amino groups with polyimides. The excellent heat resistance themselves can improve the thermal performance of the composite films. In addition, their mesoporous property increase the proportion of air (the minimum dielectric constant is 1.00056) in the composite films and reduce their dielectric performance. When the addition amount is 5 wt%, the dielectric constant of the composites at 10 MHz is 2.39, the dielectric loss is 0.02, and the glass transition temperature is 222.92°C. Therefore, the present work provides a promising solution for the preparation of PIs for the microelectronics industry with low dielectric constant and excellent thermal properties.

Published in	American Journal of Polymer Science and Technology (Volume 8, Issue 2)
DOI	10.11648/j.ajpst.20220802.11
Page(s)	21-27
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2024. Published by Science Publishing Group

Keywords

Polyimide, Mesoporous SiO₂, Composite Films, Low Dielectric Constant

References

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[3]	Liu Hao, Zhao Fuxing, Li Hanxin. (2022) Modified hollow glass microspheres composite isocyanate-based polyimide foam with improving mechanical and thermal insulation properties. High Performance Polymers.
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[5]	Yumi Kourakata, Tsunenobu Onodera, Hitoshi Kasai. (2020) Ultra-low dielectric properties of porous polyimide thin films fabricated by using the two kinds of templates with different particle sizes. Polymer.
[6]	Zhang Daohong, Xiao Daiyong, Yu Qian. (2017) Preparation of Mesoporous Silica from Electrolytic Manganese Slags by Using Amino-Ended Hyperbranched Polyamide as Template. ACS Sustainable Chem. Eng.
[7]	Wang Qihua, Wang Chao, Wang Tingmei. (2017) Controllable low dielectric porous polyimide films templated by silica microspheres: Microstructure, formation mechanism, and properties. Journal of Colloid and Interface Science.
[8]	Kaked. Maex (2003) Low dielectric constant materials for microelectronics. Applied physics reviews-focused review.
[9]	Paul A. Kohl. (2011) Low–Dielectric Constant Insulators for Future Integrated Circuits and Packages. Annu. Rev. Chem. Biomol. Eng.
[10]	Ji Sun Im, Tae-Sung Bae, Sung Kyu Lee. (2010) Effects of porous carbon additives and induced fluorine on low dielectric constant polyimide synthesized with an e-beam. Materials Research Bulletin.
[11]	Wu Tingting, Dong Jing, Gan Feng, et al. (2018) Low dielectric constant and moisture-resistant polyimide aerogels containing trifluoromethyl pendent groups. Applied Surface Science.
[12]	Ye Yunsheng. (2006) Synthesis and properties of low-dielectric-constant polyimides with introduced reactive fluorine polyhedral oligomeric silsesquioxanes. Journal of Polymer Science Part A: Polymer Chemistry.
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[16]	Meador, Mcmillon. (2014) Dielectric and Other Properties of Polyimide Aerogels Containing Fluorinated Blocks. ACS Applied Materials & Interfaces.

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APA Style

Zi-xiang Wang, Rong-rong Zheng, Lei Han, Shu-wu Chen, Hong-tao Wu, et al. (2022). Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant. American Journal of Polymer Science and Technology, 8(2), 21-27. https://doi.org/10.11648/j.ajpst.20220802.11

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ACS Style

Zi-xiang Wang; Rong-rong Zheng; Lei Han; Shu-wu Chen; Hong-tao Wu, et al. Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant. Am. J. Polym. Sci. Technol. 2022, 8(2), 21-27. doi: 10.11648/j.ajpst.20220802.11

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AMA Style

Zi-xiang Wang, Rong-rong Zheng, Lei Han, Shu-wu Chen, Hong-tao Wu, et al. Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant. Am J Polym Sci Technol. 2022;8(2):21-27. doi: 10.11648/j.ajpst.20220802.11

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@article{10.11648/j.ajpst.20220802.11,
  author = {Zi-xiang Wang and Rong-rong Zheng and Lei Han and Shu-wu Chen and Hong-tao Wu and Jing-ying Wang and Xing-wei Li and Hongjing Liu and Liyan Wang},
  title = {Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant},
  journal = {American Journal of Polymer Science and Technology},
  volume = {8},
  number = {2},
  pages = {21-27},
  doi = {10.11648/j.ajpst.20220802.11},
  url = {https://doi.org/10.11648/j.ajpst.20220802.11},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ajpst.20220802.11},
  abstract = {In this paper, mesoporous silica (NH2-SiO2) containing amino groups was firstly prepared using amino-ended hyperbranched polyamides as template agent and KH550 as surface treatment agent, and then polyimide/mesoporous NH2-SiO2 composites with low dielectric constant were successfully prepared by in situ polymerization method. The composite materiasl not only have excellent thermal properties but also have a very low dielectric constant compared to pure polyimides. The SEM results show that the surface of mesoporous NH2-SiO2 has an increased amount of wrinkles after surface treatment, and a uniform film is formed due to the excellent compatibility of mesoporous NH2-SiO2 containing amino groups with polyimides. The excellent heat resistance themselves can improve the thermal performance of the composite films. In addition, their mesoporous property increase the proportion of air (the minimum dielectric constant is 1.00056) in the composite films and reduce their dielectric performance. When the addition amount is 5 wt%, the dielectric constant of the composites at 10 MHz is 2.39, the dielectric loss is 0.02, and the glass transition temperature is 222.92°C. Therefore, the present work provides a promising solution for the preparation of PIs for the microelectronics industry with low dielectric constant and excellent thermal properties.},
 year = {2022}
}

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TY  - JOUR
T1  - Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant
AU  - Zi-xiang Wang
AU  - Rong-rong Zheng
AU  - Lei Han
AU  - Shu-wu Chen
AU  - Hong-tao Wu
AU  - Jing-ying Wang
AU  - Xing-wei Li
AU  - Hongjing Liu
AU  - Liyan Wang
Y1  - 2022/05/24
PY  - 2022
N1  - https://doi.org/10.11648/j.ajpst.20220802.11
DO  - 10.11648/j.ajpst.20220802.11
T2  - American Journal of Polymer Science and Technology
JF  - American Journal of Polymer Science and Technology
JO  - American Journal of Polymer Science and Technology
SP  - 21
EP  - 27
PB  - Science Publishing Group
SN  - 2575-5986
UR  - https://doi.org/10.11648/j.ajpst.20220802.11
AB  - In this paper, mesoporous silica (NH2-SiO2) containing amino groups was firstly prepared using amino-ended hyperbranched polyamides as template agent and KH550 as surface treatment agent, and then polyimide/mesoporous NH2-SiO2 composites with low dielectric constant were successfully prepared by in situ polymerization method. The composite materiasl not only have excellent thermal properties but also have a very low dielectric constant compared to pure polyimides. The SEM results show that the surface of mesoporous NH2-SiO2 has an increased amount of wrinkles after surface treatment, and a uniform film is formed due to the excellent compatibility of mesoporous NH2-SiO2 containing amino groups with polyimides. The excellent heat resistance themselves can improve the thermal performance of the composite films. In addition, their mesoporous property increase the proportion of air (the minimum dielectric constant is 1.00056) in the composite films and reduce their dielectric performance. When the addition amount is 5 wt%, the dielectric constant of the composites at 10 MHz is 2.39, the dielectric loss is 0.02, and the glass transition temperature is 222.92°C. Therefore, the present work provides a promising solution for the preparation of PIs for the microelectronics industry with low dielectric constant and excellent thermal properties.
VL  - 8
IS  - 2
ER  -

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Author Information

Zi-xiang Wang

School of Petrochemical Engineering, Shenyang University of Technology, Shenyang, P. R. China
Rong-rong Zheng

School of Petrochemical Engineering, Shenyang University of Technology, Shenyang, P. R. China
Lei Han

School of Petrochemical Engineering, Shenyang University of Technology, Shenyang, P. R. China
Shu-wu Chen

Aromatics Laboratory, Liaoyang Petrochemical Company, Petrochina, P. R. China
Hong-tao Wu

Aromatics Laboratory, Liaoyang Petrochemical Company, Petrochina, P. R. China
Jing-ying Wang

School of Petrochemical Engineering, Shenyang University of Technology, Shenyang, P. R. China
Xing-wei Li

Liaoning Inspection, Testing and Certification Center, Shenyang, P. R. China
Hongjing Liu

School of Petrochemical Engineering, Shenyang University of Technology, Shenyang, P. R. China
Liyan Wang

School of Petrochemical Engineering, Shenyang University of Technology, Shenyang, P. R. China

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Plain Text BibTeX RIS

APA Style

Zi-xiang Wang, Rong-rong Zheng, Lei Han, Shu-wu Chen, Hong-tao Wu, et al. (2022). Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant. American Journal of Polymer Science and Technology, 8(2), 21-27. https://doi.org/10.11648/j.ajpst.20220802.11

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ACS Style

Zi-xiang Wang; Rong-rong Zheng; Lei Han; Shu-wu Chen; Hong-tao Wu, et al. Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant. Am. J. Polym. Sci. Technol. 2022, 8(2), 21-27. doi: 10.11648/j.ajpst.20220802.11

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AMA Style

Zi-xiang Wang, Rong-rong Zheng, Lei Han, Shu-wu Chen, Hong-tao Wu, et al. Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant. Am J Polym Sci Technol. 2022;8(2):21-27. doi: 10.11648/j.ajpst.20220802.11

Copy | Download

@article{10.11648/j.ajpst.20220802.11,
  author = {Zi-xiang Wang and Rong-rong Zheng and Lei Han and Shu-wu Chen and Hong-tao Wu and Jing-ying Wang and Xing-wei Li and Hongjing Liu and Liyan Wang},
  title = {Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant},
  journal = {American Journal of Polymer Science and Technology},
  volume = {8},
  number = {2},
  pages = {21-27},
  doi = {10.11648/j.ajpst.20220802.11},
  url = {https://doi.org/10.11648/j.ajpst.20220802.11},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ajpst.20220802.11},
  abstract = {In this paper, mesoporous silica (NH2-SiO2) containing amino groups was firstly prepared using amino-ended hyperbranched polyamides as template agent and KH550 as surface treatment agent, and then polyimide/mesoporous NH2-SiO2 composites with low dielectric constant were successfully prepared by in situ polymerization method. The composite materiasl not only have excellent thermal properties but also have a very low dielectric constant compared to pure polyimides. The SEM results show that the surface of mesoporous NH2-SiO2 has an increased amount of wrinkles after surface treatment, and a uniform film is formed due to the excellent compatibility of mesoporous NH2-SiO2 containing amino groups with polyimides. The excellent heat resistance themselves can improve the thermal performance of the composite films. In addition, their mesoporous property increase the proportion of air (the minimum dielectric constant is 1.00056) in the composite films and reduce their dielectric performance. When the addition amount is 5 wt%, the dielectric constant of the composites at 10 MHz is 2.39, the dielectric loss is 0.02, and the glass transition temperature is 222.92°C. Therefore, the present work provides a promising solution for the preparation of PIs for the microelectronics industry with low dielectric constant and excellent thermal properties.},
 year = {2022}
}

Copy | Download

TY  - JOUR
T1  - Preparation and Properties of Polyimide/Mesoporous SiO2 Composite Films with Low Dielectric Constant
AU  - Zi-xiang Wang
AU  - Rong-rong Zheng
AU  - Lei Han
AU  - Shu-wu Chen
AU  - Hong-tao Wu
AU  - Jing-ying Wang
AU  - Xing-wei Li
AU  - Hongjing Liu
AU  - Liyan Wang
Y1  - 2022/05/24
PY  - 2022
N1  - https://doi.org/10.11648/j.ajpst.20220802.11
DO  - 10.11648/j.ajpst.20220802.11
T2  - American Journal of Polymer Science and Technology
JF  - American Journal of Polymer Science and Technology
JO  - American Journal of Polymer Science and Technology
SP  - 21
EP  - 27
PB  - Science Publishing Group
SN  - 2575-5986
UR  - https://doi.org/10.11648/j.ajpst.20220802.11
AB  - In this paper, mesoporous silica (NH2-SiO2) containing amino groups was firstly prepared using amino-ended hyperbranched polyamides as template agent and KH550 as surface treatment agent, and then polyimide/mesoporous NH2-SiO2 composites with low dielectric constant were successfully prepared by in situ polymerization method. The composite materiasl not only have excellent thermal properties but also have a very low dielectric constant compared to pure polyimides. The SEM results show that the surface of mesoporous NH2-SiO2 has an increased amount of wrinkles after surface treatment, and a uniform film is formed due to the excellent compatibility of mesoporous NH2-SiO2 containing amino groups with polyimides. The excellent heat resistance themselves can improve the thermal performance of the composite films. In addition, their mesoporous property increase the proportion of air (the minimum dielectric constant is 1.00056) in the composite films and reduce their dielectric performance. When the addition amount is 5 wt%, the dielectric constant of the composites at 10 MHz is 2.39, the dielectric loss is 0.02, and the glass transition temperature is 222.92°C. Therefore, the present work provides a promising solution for the preparation of PIs for the microelectronics industry with low dielectric constant and excellent thermal properties.
VL  - 8
IS  - 2
ER  -

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